DocumentCode
2122001
Title
Implementation of response surface methodology using variance reduction techniques in semiconductor manufacturing
Author
McAllister, Charles D. ; Altuntas, Bertan ; Frank, Matthew ; Potoradi, Juergen
Author_Institution
Marcus Dept. of Ind. & Manuf. Eng., Pennsylvania State Univ., University Park, PA, USA
Volume
2
fYear
2001
fDate
2001
Firstpage
1225
Abstract
Semiconductor manufacturing is generally considered a cyclic industry. As such, individual producers able to react quickly and appropriately to market conditions will have a competitive advantage. Manufacturers who maintain low work in process inventory, ensure that specialized equipment is in good repair, and produce quality products at least possible cost will have the best opportunities to effectively compete and excel in these challenging venues. To support this nimble business model, our current efforts are directed toward creating efficient, accurate metamodels of the impact of maintenance policies on production efficiency. These validated polynomial approximations facilitate rapid exploration of the design region, compared with the original simulation models. The experiment design used for metamodel construction employed variance reduction techniques. When compared to a similar experiment design using independent streams, the variance reduction approach provided a decrease in standard error of the regression coefficients and smaller average error when validated against the simulation response
Keywords
design of experiments; integrated circuit manufacture; production control; statistical analysis; surface fitting; average error; experiment design; maintenance policies; metamodel construction; nimble business model; polynomial approximations; production efficiency; response surface methodology; semiconductor manufacturing; simulation response; standard error of regression coefficients; variance reduction techniques; Assembly; Bonding; Lead; Manufacturing industries; Packaging; Response surface methodology; SDRAM; Semiconductor device manufacture; Silicon; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference, 2001. Proceedings of the Winter
Conference_Location
Arlington, VA
Print_ISBN
0-7803-7307-3
Type
conf
DOI
10.1109/WSC.2001.977438
Filename
977438
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