• DocumentCode
    2122001
  • Title

    Implementation of response surface methodology using variance reduction techniques in semiconductor manufacturing

  • Author

    McAllister, Charles D. ; Altuntas, Bertan ; Frank, Matthew ; Potoradi, Juergen

  • Author_Institution
    Marcus Dept. of Ind. & Manuf. Eng., Pennsylvania State Univ., University Park, PA, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    1225
  • Abstract
    Semiconductor manufacturing is generally considered a cyclic industry. As such, individual producers able to react quickly and appropriately to market conditions will have a competitive advantage. Manufacturers who maintain low work in process inventory, ensure that specialized equipment is in good repair, and produce quality products at least possible cost will have the best opportunities to effectively compete and excel in these challenging venues. To support this nimble business model, our current efforts are directed toward creating efficient, accurate metamodels of the impact of maintenance policies on production efficiency. These validated polynomial approximations facilitate rapid exploration of the design region, compared with the original simulation models. The experiment design used for metamodel construction employed variance reduction techniques. When compared to a similar experiment design using independent streams, the variance reduction approach provided a decrease in standard error of the regression coefficients and smaller average error when validated against the simulation response
  • Keywords
    design of experiments; integrated circuit manufacture; production control; statistical analysis; surface fitting; average error; experiment design; maintenance policies; metamodel construction; nimble business model; polynomial approximations; production efficiency; response surface methodology; semiconductor manufacturing; simulation response; standard error of regression coefficients; variance reduction techniques; Assembly; Bonding; Lead; Manufacturing industries; Packaging; Response surface methodology; SDRAM; Semiconductor device manufacture; Silicon; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2001. Proceedings of the Winter
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    0-7803-7307-3
  • Type

    conf

  • DOI
    10.1109/WSC.2001.977438
  • Filename
    977438