• DocumentCode
    2122260
  • Title

    Comparative study of printed circuit board substrates used for thermal management of high power LEDs

  • Author

    Freisleben, Jaroslav ; Dzugan, Tomas ; Hamacek, Ales

  • Author_Institution
    Department of Technologies and Measurement, University of West Bohemia/RICE, Pilsen, Czech Republic
  • fYear
    2015
  • fDate
    6-10 May 2015
  • Firstpage
    80
  • Lastpage
    84
  • Abstract
    The goal of this study is to compare thermal parameters of different substrates for high power light-emitting diodes (LEDs) with emphasis on the cost and size. The standard glass epoxy substrate (FR4) with thermal vias and insulated metallic substrate (IMS) were chosen as suitable samples for this study. Thermal simulation and thermal start-up were performed in order to evaluate the heat dissipation of high power LED.
  • Keywords
    Light emitting diodes; Substrates; Temperature measurement; Thermal analysis; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2015 38th International Spring Seminar on
  • Conference_Location
    Eger, Hungary
  • Type

    conf

  • DOI
    10.1109/ISSE.2015.7247967
  • Filename
    7247967
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2122260