Title :
Comparative study of printed circuit board substrates used for thermal management of high power LEDs
Author :
Freisleben, Jaroslav ; Dzugan, Tomas ; Hamacek, Ales
Author_Institution :
Department of Technologies and Measurement, University of West Bohemia/RICE, Pilsen, Czech Republic
Abstract :
The goal of this study is to compare thermal parameters of different substrates for high power light-emitting diodes (LEDs) with emphasis on the cost and size. The standard glass epoxy substrate (FR4) with thermal vias and insulated metallic substrate (IMS) were chosen as suitable samples for this study. Thermal simulation and thermal start-up were performed in order to evaluate the heat dissipation of high power LED.
Keywords :
Light emitting diodes; Substrates; Temperature measurement; Thermal analysis; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location :
Eger, Hungary
DOI :
10.1109/ISSE.2015.7247967
