DocumentCode
2122416
Title
Component placement optimizations on PCBs for improved thermal behaviour
Author
Fodor, Alexandra ; Jano, Rajmond ; Pitica, Dan
Author_Institution
Applied Electronics Department, Technical University of Cluj-Napoca, Romania
fYear
2015
fDate
6-10 May 2015
Firstpage
114
Lastpage
117
Abstract
The presented work investigates the thermal design process for electronic systems by studying the placement of critical components, which dissipate large amounts of heat. The research was done in order to define a “thermal placement outline” depending on the speed of the air flow when forced convection is used and on the base dimensions of the component. Several simulations were carried out using SolidWorks Flow Simulation tool, the speed of the air flow and the width of the component being varied. The air trajectory was studied, as well as the temperature at the PCB surface.
Keywords
Atmospheric modeling; Computational fluid dynamics; Computational modeling; Heating; Seminars; Springs; Trajectory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location
Eger, Hungary
Type
conf
DOI
10.1109/ISSE.2015.7247973
Filename
7247973
Link To Document