Title :
A comparison of the shear strength of conductive adhesives and soldering alloys
Author :
Hirman, Martin ; Steiner, Frantisek
Author_Institution :
University of West Bohemia, Faculty of Electrical Engineering, Department of Technologies and Measurement, Pilsen, Czech Republic
Abstract :
This paper describes the influence of the cure schedule on the shear strength of the joint glued by EPO-TEK® H20S and 8331S. This work also describes the influence of solder alloy types on the shear strength of the solder joint. Joints were made by soldering and gluing of chip resistors 1206, 0805 and 0603 with different temperature profiles on rigid and flexible substrates. For soldering profiles were calculated heating factors. These profiles have an effect on the mechanical strength of the joint. Samples are measured after curing/soldering process by using shear strength test.
Keywords :
Conductive adhesives; Curing; Joints; Metals; Soldering; Substrates; Temperature measurement;
Conference_Titel :
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location :
Eger, Hungary
DOI :
10.1109/ISSE.2015.7247983
