• DocumentCode
    2122979
  • Title

    An Exploratory Study of Integrated Product Design and Development

  • Author

    Lau, R.S.M.

  • Author_Institution
    Hong Kong University of Science and Technology, Hong Kong
  • fYear
    2007
  • fDate
    27-29 Aug. 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    To accelerate the product design and development process, many companies have adopted a cross-functional, integrated development approach, widely known as concurrent engineering (CE), to designing a product and its associated processes. The purposes of this study are to examine (1) the effects of organizational and technological enablers on CE implementation, and (2) the effects of CE implementation on product design and development (PDD) performance and business performance. We based our analyses on survey data obtained from 382 U.S. companies in the computer and electronics industries (SIC 357 and 367), that have demonstrated a high degree of market uncertainty and innovation in recent years. Our results found strong evidences to support the links between CE enablers and CE implementation as well as CE implementation and PDD performance. Although the correlation between PDD performance and business performance was found statistically significant, the explanatory power of the analysis was limited. That leads us to believe that a company´s business performance is influenced by a much more complex system than the one articulated in this study; but the practice of CE does have a positive, indirect effect on a company´s business performance through better PDD performance.
  • Keywords
    Acceleration; Companies; Concurrent engineering; Data analysis; Electronics industry; Performance analysis; Product design; Silicon carbide; Technological innovation; Uncertainty; Computer & electronics industry; concurrent engineering; correlation analysis; product design & development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Service Operations and Logistics, and Informatics, 2007. SOLI 2007. IEEE International Conference on
  • Conference_Location
    Philadelphia, PA, USA
  • Print_ISBN
    978-1-4244-1118-4
  • Electronic_ISBN
    978-1-4244-1118-4
  • Type

    conf

  • DOI
    10.1109/SOLI.2007.4383931
  • Filename
    4383931