DocumentCode
2123116
Title
Detection of defects on BGA solder balls using 2D and 3D methods
Author
Rihak, Pavel ; Vala, Radek ; Szendiuch, Ivan
Author_Institution
Department of Microelectronics, Brno University of Technology, Czech Republic
fYear
2015
fDate
6-10 May 2015
Firstpage
245
Lastpage
249
Abstract
The paper is focused on non-destructive X-Ray method used for detection of defects. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used on daily basis. 3D method is less common and it is used for unique defects for further examination. The main contribution of this work is to allow more detailed investigation of the defects structure than before. It also describes individual defect using the 3D model. This paper deals with using these methods.
Keywords
Inspection; Lead; Reliability; Soldering; Surface treatment; Three-dimensional displays; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location
Eger, Hungary
Type
conf
DOI
10.1109/ISSE.2015.7247999
Filename
7247999
Link To Document