A general methodology of modelling 3D discontinuities using the TLM method

In this paper, we present a methodology for analysing interconnections in high speed logic devices using a full wave 3D technique. The 3D TLM method is used to compute in time domain the electromagnetic field in the structure. S-parameters of discontinuities are calculated from reflected and transmitted electromagnetic fields. An equivalent network of the discontinuity is extracted from the calculated S-parameters. This methodology is general and can be applied to any planar or 3D discontinuity, over a wide range of frequency. To illustrate its performance, results are presented for a microstrip right angle bend and a via up to 60 GHz.