Assembly method and its influence on electrically conductive adhesives and solder pastes joints durability

Reliability of electronic devices is heavily dependent on joint quality and durability under various ambient conditions. This article is focused on comparing of different assembly methods, particularly stencil printing and dispensing paste deposition and compares lead and lead-free solder pastes with one-component and two-component epoxy based electrically conductive adhesives. The evaluation method is based on resistance measurement after accelerated stress tests. The aging was conducted using automatic mechanical cyclic stress machine tester and joint resistance to environment was tested using long term temperature straining and combined humidity and temperature straining. Shear strength measurement was done in order to determine mechanical stability of the connection.