DocumentCode
2123999
Title
Stress and strain in automotive diodes-a RVT, IR and XR study
Author
Galateanu, L. ; Stoica, Miheala ; Bozdog, C. ; Popa, E. ; Stoica, A.D.
Author_Institution
ICCE, Bucharest, Romania
Volume
2
fYear
1996
fDate
9-12 Oct 1996
Firstpage
439
Abstract
The methods of achieving the needed reliability for the automotive rectifier CAN diodes are discussed. The RVT tool needed for investigation was found, a new stress relief shape was designed and IR and XR investigations were performed toward the complete elimination of the residual strain left behind the grinding and diffusion processes. An IR method of the rough surface layer characterization is for the first time employed and the optical configuration for XR experiments was improved in angular resolution
Keywords
automotive electronics; failure analysis; internal stresses; semiconductor device packaging; semiconductor device reliability; solid-state rectifiers; RVT; angular resolution; automotive diodes; diffusion process; grinding; optical configuration; rectifier CAN diodes; reliability; residual strain; rough surface layer characterization; stress relief shape; Automotive engineering; Capacitive sensors; Diodes; Performance evaluation; Rough surfaces; Silicon; Soldering; Stress; Surface roughness; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 1996., International
Conference_Location
Sinaia
Print_ISBN
0-7803-3223-7
Type
conf
DOI
10.1109/SMICND.1996.557414
Filename
557414
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