DocumentCode :
2124172
Title :
The new generation of power semiconductor devices
Author :
Amaratunga, Gehan A J ; Udea, F.
Author_Institution :
Dept. of Electr. Eng. & Electron., Liverpool Univ., UK
Volume :
2
fYear :
1996
fDate :
9-12 Oct 1996
Firstpage :
469
Abstract :
The next generation of power devices are likely to extend MOS controlled bipolar (MCB) device concepts to cover very high voltage (up to 6 kV) applications. Such devices will be based on utilising the advantages brought about by trench gate MOSFETs to control bipolar current flow. The semiconductor phenomena which can be accessed to optimise power device performance through use of trench gate MOS channels are discussed. Device structures which use PIN diode and thyristor type carrier distributions to reduce power loss within the device are presented. The next generation of power switching devices is proposed as being based on trench gate devices which have hybrid PIN diode and dynamic thyristor structures
Keywords :
MOS-controlled thyristors; elemental semiconductors; insulated gate bipolar transistors; losses; p-i-n diodes; power semiconductor devices; silicon; 6 kV; MOS controlled bipolar devices; PIN diode; Si; VHV applications; power loss reduction; power semiconductor devices; power switching devices; thyristor type carrier distributions; trench gate MOS channels; trench gate devices; very high voltage applications; Cathodes; Equivalent circuits; Insulated gate bipolar transistors; MOSFETs; Power engineering and energy; Power generation; Power semiconductor devices; Solid state circuits; Thyristors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 1996., International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-3223-7
Type :
conf
DOI :
10.1109/SMICND.1996.557421
Filename :
557421
Link To Document :
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