• DocumentCode
    2124595
  • Title

    A temperature-aware synthesis approach for simultaneous delay and leakage optimization

  • Author

    Conos, Nathaniel A. ; Potkonjak, Miodrag

  • Author_Institution
    Comput. Sci. Dept., Univ. of California, Los Angeles, Los Angeles, CA, USA
  • fYear
    2013
  • fDate
    6-9 Oct. 2013
  • Firstpage
    316
  • Lastpage
    321
  • Abstract
    Accurate thermal knowledge is essential for achieving ultra low power in deep sub-micron CMOS technology, as it affects gate speed linearly and leakage exponentially. We propose a temperature-aware synthesis technique that efficiently utilizes input vector control (IVC), dual-threshold voltage gate sizing (GS) and pin reordering (PR) for performing simultaneous delay and leakage power optimization. To the best of our knowledge, we are the first to consider these techniques in a synergistic fashion with thermal knowledge. We evaluate our approach by showing improvements over each method when considered in isolation and in conjunction. We also study the impact of employing considered techniques with/without accurate thermal knowledge. We ran simulations on synthesized ISCAS-85 and ITC-99 circuits on a 45 nm cell library while conforming to an industrial design flow. Leakage power improvements of up to 4.54X (2.14X avg.) were achieved when applying thermal knowledge over equivalent methods that do not.
  • Keywords
    CMOS integrated circuits; integrated circuit design; optimisation; ISCAS-85; ITC-99 circuit; IVC; deep submicron CMOS technology; delay optimization; dual-threshold voltage gate sizing; gate speed; input vector control; leakage power optimization; pin reordering; size 45 nm; synergistic fashion; temperature-aware synthesis; thermal knowledge; CMOS integrated circuits; Delays; Integrated circuit modeling; Libraries; Logic gates; Optimization; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2013 IEEE 31st International Conference on
  • Conference_Location
    Asheville, NC
  • Type

    conf

  • DOI
    10.1109/ICCD.2013.6657059
  • Filename
    6657059