DocumentCode
2126453
Title
In-phase resonant inductive coupling for multi-layer vertical communication in 3D-ICs
Author
Han, Sangwook ; Wentzloff, David D.
Author_Institution
Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2012
fDate
8-14 July 2012
Firstpage
1
Lastpage
2
Abstract
A signal boosting scheme for wireless inductive interconnects in 3D-ICs is proposed. It enables longer distance communication through multiple-stacked layers without increasing coil size by using in-phase resonant inductive coupling and regenerative oscillation. Measurement results show the received signal is improved by 16dB compared to a conventional standard inductive coupling method with and aspect ratio of 4:1.
Keywords
coils; electromagnetic induction; integrated circuit interconnections; three-dimensional integrated circuits; 3D IC; coil size; distance communication; inphase resonant inductive coupling; multilayer vertical communication; multiple-stacked layers; regenerative oscillation; signal boosting scheme; wireless inductive interconnects; Boosting; Coils; Couplings; Oscillators; Resonant frequency; Silicon carbide; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium (APSURSI), 2012 IEEE
Conference_Location
Chicago, IL
ISSN
1522-3965
Print_ISBN
978-1-4673-0461-0
Type
conf
DOI
10.1109/APS.2012.6347946
Filename
6347946
Link To Document