• DocumentCode
    2127471
  • Title

    NURA: a feasible, gas-dielectric interconnect process

  • Author

    Anand, M.B. ; Yamada, M. ; Shibata, H.

  • Author_Institution
    Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
  • fYear
    1996
  • fDate
    11-13 June 1996
  • Firstpage
    82
  • Lastpage
    83
  • Abstract
    We have proposed a gas-dielectric interconnect process, and demonstrated its feasibility. While several engineering problems need to tackled before the proposed process is manufacturable, the incentive for further development of this process is huge since it can lead to the minimum physical value of the relative dielectric constant, 1.0.
  • Keywords
    dielectric materials; integrated circuit interconnections; permittivity; NURA; dielectric constant; gas-dielectric interconnect; Dielectric constant; Manufacturing processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1996. Digest of Technical Papers. 1996 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-3342-X
  • Type

    conf

  • DOI
    10.1109/VLSIT.1996.507801
  • Filename
    507801
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2127471