DocumentCode
2128391
Title
Strengthening the link between business decisions and RE: Long-term product planning in software product companies
Author
Lehtola, Laura ; Kauppinen, Marjo ; Vähäniitty, Jarno
Author_Institution
Helsinki Univ. of Technol., Helsinki
fYear
2007
fDate
15-19 Oct. 2007
Firstpage
153
Lastpage
162
Abstract
Long-term product planning (i.e. roadmapping) is an approach that companies operating in the software product business have used to bridge the gap between business planning and product development. A strong link between strategy and product development is important, since companies developing software products need to select requirements for forthcoming releases based on the business decisions of the company. However, in practice, connecting requirements engineering decisions and business management is far from trivial. This paper reports lessons learned from four software product companies that recognize the need for more business-oriented long- term product planning. The study was conducted using the action research approach. We identified four practices that seem to strengthen the link between business decisions and requirements engineering. These are: 1) explicating the planning levels and time horizons needed in product planning, 2) separating the planning of business goals relating to products from R&D resource allocation, 3) conducting open-ended planning by pre-defined rhythm and 4) emphasizing whole-product thinking.
Keywords
DP industry; planning; product development; business decisions; business management; business planning; business-oriented long-term product planning; open-ended planning; product development; requirements engineering decisions; resource allocation; software product companies; Bridges; Business; Companies; Engineering management; Job production systems; Joining processes; Product development; Programming; Software development management; Technology planning;
fLanguage
English
Publisher
ieee
Conference_Titel
Requirements Engineering Conference, 2007. RE '07. 15th IEEE International
Conference_Location
Delhi
ISSN
1090-705X
Print_ISBN
978-0-7695-2935-6
Type
conf
DOI
10.1109/RE.2007.30
Filename
4384178
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