An electromigration failure model of tungsten plug contacts/vias for realistic lifetime prediction

An EM failure model which considers the incubation time and Al drift time separately has been established. The model predicts that the lifetimes of Al-Cu interconnects at the W plug contacts/vias under operating conditions are dominated by Cu diffusion (incubation time) in Al-Cu. For a realistic EM lifetime prediction of VLSI interconnects under operating conditions, the understanding of Cu movement during current stress is essential.