DocumentCode
2128810
Title
Defect free assembly of SMT devices
Author
Desai, Hasit
fYear
1997
fDate
22-25 Sep 1997
Firstpage
677
Lastpage
682
Abstract
Process control is the only way to achieve defect free soldering. Soldering is a simple and repeatable process which is easily controllable. Inspection is less than 70% effective and cannot guarantee joint quality. Reworking and touch-up always reduces the life of solder joints. Inspection and reworking add nothing to the value of the product. A correctly set-up machine can never cause defective joints if PCBs and components are meeting solderability specifications. Solderability has a finite life usually of not more than six months. The PCB manufacturers shop is nothing but an extension to a manufacturing shop. Process control during bare PCB manufacturing results in good solder quality. Dewetting or nonwetting is usually caused by poor solderability of PCB or components. Blow holes indicate that there is a lack of control in a PCB fabrication process. Pin holes in solder joints indicates that the board manufacturer should review his drilling, hole cleaning and plating process. Touch up has no relation with reliability improvement of solder joints, it improves only cosmetics
Keywords
printed circuit manufacture; soldering; surface mount technology; PCB fabrication process; SMT devices; blow holes; defect free assembly; defect free soldering; dewetting; inspection; nonwetting; pin holes; process control; reworking; solder joint life reduction; solderability specifications; touch-up;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1997, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location
Rosemont, IL
ISSN
0362-2479
Print_ISBN
0-7803-3959-2
Type
conf
DOI
10.1109/EEIC.1997.651278
Filename
651278
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