• DocumentCode
    2128810
  • Title

    Defect free assembly of SMT devices

  • Author

    Desai, Hasit

  • fYear
    1997
  • fDate
    22-25 Sep 1997
  • Firstpage
    677
  • Lastpage
    682
  • Abstract
    Process control is the only way to achieve defect free soldering. Soldering is a simple and repeatable process which is easily controllable. Inspection is less than 70% effective and cannot guarantee joint quality. Reworking and touch-up always reduces the life of solder joints. Inspection and reworking add nothing to the value of the product. A correctly set-up machine can never cause defective joints if PCBs and components are meeting solderability specifications. Solderability has a finite life usually of not more than six months. The PCB manufacturers shop is nothing but an extension to a manufacturing shop. Process control during bare PCB manufacturing results in good solder quality. Dewetting or nonwetting is usually caused by poor solderability of PCB or components. Blow holes indicate that there is a lack of control in a PCB fabrication process. Pin holes in solder joints indicates that the board manufacturer should review his drilling, hole cleaning and plating process. Touch up has no relation with reliability improvement of solder joints, it improves only cosmetics
  • Keywords
    printed circuit manufacture; soldering; surface mount technology; PCB fabrication process; SMT devices; blow holes; defect free assembly; defect free soldering; dewetting; inspection; nonwetting; pin holes; process control; reworking; solder joint life reduction; solderability specifications; touch-up;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1997, and Electrical Manufacturing & Coil Winding Conference. Proceedings
  • Conference_Location
    Rosemont, IL
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-3959-2
  • Type

    conf

  • DOI
    10.1109/EEIC.1997.651278
  • Filename
    651278