DocumentCode :
2128965
Title :
Sensitivity analysis of shielded coupled interconnects for RFIC applications
Author :
Tabrizi, Mohammad Moghaddam ; Deilami, Mahsa ; Asgari, Ahmad ; Masoumi, Nasser
Author_Institution :
Fac. of Electr. & Comput. Eng., Tehran Univ., Tehran
fYear :
2008
fDate :
4-7 May 2008
Abstract :
In this paper the sensitivity of on-chip interconnects to Si CMOS process parameters in two different structures is reported; two coupled lines with and without shielding. Simulations are performed using HSpiceRF to emulate the state-of-the-art and the future technologies for the test structures. Some important parameters characterizing the coupled interconnects have been examined. Shielding effectiveness (SE) on crosstalk reduction is computed using HSpiceRF simulation results in order to compare the efficiency of shielding structures with different process parameters. Additionally we investigate the influence of the process parameter in deep sub-micron technologies on the transmission, reflection, near-end, and far-end crosstalk characteristics of the coupled interconnect with and without the presence of shielding lines.
Keywords :
CMOS integrated circuits; crosstalk; electromagnetic coupling; electromagnetic shielding; integrated circuit interconnections; radiofrequency integrated circuits; sensitivity analysis; CMOS process parameters; HSpiceRF; RFIC applications; crosstalk reduction; deep sub-micron technologies; far-end crosstalk characteristics; onchip interconnects; sensitivity analysis; shielded coupled interconnects; shielding effectiveness; CMOS process; CMOS technology; Computational modeling; Couplings; Crosstalk; Performance evaluation; Radiofrequency integrated circuits; Reflection; Sensitivity analysis; Testing; Crosstalk; shielding effectiveness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Computer Engineering, 2008. CCECE 2008. Canadian Conference on
Conference_Location :
Niagara Falls, ON
ISSN :
0840-7789
Print_ISBN :
978-1-4244-1642-4
Electronic_ISBN :
0840-7789
Type :
conf
DOI :
10.1109/CCECE.2008.4564527
Filename :
4564527
Link To Document :
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