• DocumentCode
    2129001
  • Title

    Effects of innovation on employment in Latin America

  • Author

    Crespi, Gustavo ; Tacsir, Ezequiel

  • Author_Institution
    Sci. & Technol. Div., Inter-American Dev. Bank, Washington, DC, USA
  • fYear
    2011
  • fDate
    15-17 Sept. 2011
  • Firstpage
    1
  • Lastpage
    11
  • Abstract
    This study examines the impact of process and product innovation on employment growth across four Latin American countries (Argentina, Chile, Costa Rica, and Uruguay) using micro data from innovation surveys. Specifically, we relate employment growth to process innovations and to the growth of sales separately due to innovative and unchanged products. Results show that that compensation effects are prevalent, and the introduction of new products is associated with employment growth at the firm level. Specifically, we find that for the manufacturing firms as a whole, the introduction of process innovations only affects the employment growth in the countries case of Chile. At the same time, we observe no evidence of displacement effects due to the introduction of product innovations. In fact, the observed compensation effects resulting from the introduction of new products imply, in turn, employment growth even when the replacement of old products is taken into account.
  • Keywords
    employment; innovation management; manufacturing industries; remuneration; Argentina; Chile; Costa Rica; Latin America; Uruguay; compensation effects; employment growth; manufacturing firms; process innovation; product innovation; sales growth; Employment; Equations; Investments; Marketing and sales; Productivity; Technological innovation; Developing countries; Employment; Innovation; Innovation surveys; Latin America;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Science and Innovation Policy, 2011 Atlanta Conference on
  • Conference_Location
    Atlanta, GA
  • ISSN
    2159-189X
  • Print_ISBN
    978-1-4577-1390-3
  • Electronic_ISBN
    2159-189X
  • Type

    conf

  • DOI
    10.1109/ACSIP.2011.6064465
  • Filename
    6064465