DocumentCode
2129210
Title
On-chip VCSEL interconnects enabled by 3-D interposer-based integration and polarization modulation
Author
Coldren, Larry A. ; Barve, Ajit V.
Author_Institution
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93117, USA
fYear
2015
fDate
13-15 July 2015
Firstpage
150
Lastpage
151
Abstract
Optical interconnects are required for a continued scaling of a version of Moore´s Law. VCSELs remain the most efficient sources to integrate, and these can be compatibly integrated with emerging 3-D integration technology using active interposers. Polarization-modulation can double the bisection bandwidth available together with coarse WDM and other modulation techniques.
Keywords
Drives; Modulation; Photonics; Power generation; Temperature distribution; Vertical cavity surface emitting lasers; Wavelength division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
Summer Topicals Meeting Series (SUM), 2015
Conference_Location
Nassau, Bahamas
Print_ISBN
978-1-4799-7467-2
Type
conf
DOI
10.1109/PHOSST.2015.7248241
Filename
7248241
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