• DocumentCode
    2130385
  • Title

    An ultra low-power single chip intelligent sensing platform

  • Author

    Schemm, Nathan ; Balkír, Sina ; Hoffman, Michael W.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Nebraska-Lincoln, Lincoln, NE, USA
  • fYear
    2010
  • fDate
    1-4 Nov. 2010
  • Firstpage
    1427
  • Lastpage
    1430
  • Abstract
    An ultra low-power intelligent sensing platform has been developed by the authors. The platform is based on a novel single chip solution, designed and fabricated using a 0.18 μm CMOS technology. To that end, quad-channel low-power sensor front end sections composed of event-driven amplifiers and ADCs have been integrated with a custom low-power microcontroller and a wireless interface on the same chip for extended battery life. A sensor node using only this chip can support multi-sensor interfaces, processing of the sensor signals, and provide wireless communications between a central coordinating node. On the other hand, the smart sensor platforms reported in literature are based on COTS solutions that result in significantly higher power consumption levels as well as larger footprints due to their multi-component nature. The low-power operation was verified in a range of applications that includes detection of radiation and sensing the arrival angle of acoustic signals.
  • Keywords
    CMOS analogue integrated circuits; CMOS digital integrated circuits; acoustic signal detection; intelligent sensors; low-power electronics; microcontrollers; power consumption; radiation detection; radiocommunication; sensor fusion; ADC; CMOS technology; COTS solution; acoustic signal detection; event driven amplifier; extended battery life; low power microcontroller; multicomponent nature; multisensor interface; power consumption; quad channel low power sensor signal; smart sensor; ultra low power single chip intelligent sensing platform; wireless communication; wireless interface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2010 IEEE
  • Conference_Location
    Kona, HI
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-8170-5
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2010.5690497
  • Filename
    5690497