A new fabrication process for planar thin-film multijunction thermal converters

Author

Wunsch, T.F. ; Kinard, J.R. ; Manginell, R.P. ; Solomon, O.M. ; Lipe, T.E.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

2000

fDate

14-19 May 2000

Firstpage

387

Lastpage

388

Abstract

Advanced thin film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters. The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters with optimizations for improved sensitivity, bandwidth, manufacturability, and reliability.

Keywords

ceramic packaging; converters; photoresists; seals (stoppers); sputter etching; thermal management (packaging); thermocouples; thin film devices; transfer standards; voltage measurement; AC-DC transfer standard; advanced thin film processing; back-etching; ceramic package; deep RIE; design features; dielectric membrane; fabrication process; hermetic seal; improved bandwidth; improved sensitivity; manufacturability; optimization; photoresist lift-off; planar thin-film multijunction thermal converter; reliability; resistive heater; thermal isolation; thermocouples; vacuum packaging technology; Biomembranes; Dielectric substrates; Dielectric thin films; Electronic packaging thermal management; Fabrication; Laboratories; NIST; Silicon; Sputtering; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Precision Electromagnetic Measurements Digest, 2000 Conference on

Conference_Location

Sydney, NSW, Australia

Print_ISBN

0-7803-5744-2

Type

conf

DOI

10.1109/CPEM.2000.851038

Filename

851038