Title :
A new fabrication process for planar thin-film multijunction thermal converters
Author :
Wunsch, T.F. ; Kinard, J.R. ; Manginell, R.P. ; Solomon, O.M. ; Lipe, T.E.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
Advanced thin film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters. The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters with optimizations for improved sensitivity, bandwidth, manufacturability, and reliability.
Keywords :
ceramic packaging; converters; photoresists; seals (stoppers); sputter etching; thermal management (packaging); thermocouples; thin film devices; transfer standards; voltage measurement; AC-DC transfer standard; advanced thin film processing; back-etching; ceramic package; deep RIE; design features; dielectric membrane; fabrication process; hermetic seal; improved bandwidth; improved sensitivity; manufacturability; optimization; photoresist lift-off; planar thin-film multijunction thermal converter; reliability; resistive heater; thermal isolation; thermocouples; vacuum packaging technology; Biomembranes; Dielectric substrates; Dielectric thin films; Electronic packaging thermal management; Fabrication; Laboratories; NIST; Silicon; Sputtering; Transistors;
Conference_Titel :
Precision Electromagnetic Measurements Digest, 2000 Conference on
Conference_Location :
Sydney, NSW, Australia
Print_ISBN :
0-7803-5744-2
DOI :
10.1109/CPEM.2000.851038
