DocumentCode :
2131469
Title :
Study on Bond Strength of External Thermal Insulation System with Perfusion Polyurethane Foam
Author :
Yin, Xiuqin ; Li, Huiqiang ; Bo, Haitao
Author_Institution :
Sch. of Civil Eng. & Mech., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2010
fDate :
24-26 Aug. 2010
Firstpage :
1
Lastpage :
4
Abstract :
External thermal insulation system (ETIS) is an important part of building energy efficiency. Polyurethane foam as a superior external insulation material was analyzed in this paper. The variation law of bond strength of the ETIS with polyurethane foam was studied by atmospheric exposure tests which consist of two stages including high temperature-spraying water cycle and heating-refrigeration cycle. The results show that its bond strength declined lightly with time increasing and its value is always greater than specified value. Therefore, the ETIS of composite perfusion polyurethane foam has better weatherability and it can adapt the various inconstant weather conditions. By comparing the bond strength curves of the three kinds of popular ETIS of expanded polystyrene (EPS) board, polystyrene granule mortar and polyurethane foam, the result shows that the downtrend of bond strength of composite perfusion polyurethane foam ETIS is gentlest, thereby the weatherability of polyurethane foam ETIS is best among the three ETIS.
Keywords :
bonding processes; foams; materials testing; mechanical strength; structural engineering; thermal insulation; atmospheric exposure tests; bond strength; building energy efficiency; expanded polystyrene board; external thermal insulation system; heating-refrigeration cycle; high temperature-spraying water cycle; perfusion polyurethane foam; polystyrene granule mortar; polyurethane foam; polyurethane foam weatherability; variation law; Atmospheric measurements; Construction industry; Heating; Insulation; Mortar; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Management and Service Science (MASS), 2010 International Conference on
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-5325-2
Electronic_ISBN :
978-1-4244-5326-9
Type :
conf
DOI :
10.1109/ICMSS.2010.5575456
Filename :
5575456
Link To Document :
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