Title :
T/R Module Packaging - a Challenge for Future System Design
Author_Institution :
Daimler Benz Aerospace AG, Defense and Civil Systems - Airborne Systems, wbosch@vs.dasa.de
Abstract :
Future packaging technology is driven by key parameters, such as volume and mass of the T/R module, interconnect technology and overall efficiency. These parameters and their effects on the radar system are discussed. Further, enabling techniologies to achieve performance and cost objectives are listed, an overview of European T/R module technology is given and some examples of advanced packaging technologies are presented.
Keywords :
Airborne radar; Antenna arrays; Costs; Instruments; Packaging; Phased arrays; Radar antennas; Satellites; Space technology; Spaceborne radar;
Conference_Titel :
Microwave Conference, 1997. 27th European
Conference_Location :
Jerusalem, Israel
DOI :
10.1109/EUMA.1997.337764
