DocumentCode :
2131655
Title :
Study on preparation of copper matrix composites reinforced by SiC and Graphite particles
Author :
Niansuo, Xie ; Jin, Wang
Author_Institution :
Sch. of Mater. Sci. & Eng., Shaanxi Univ. of Technol., Hanzhong, China
fYear :
2012
fDate :
21-23 April 2012
Firstpage :
1333
Lastpage :
1336
Abstract :
The copper matrix composites reinforced by SiC and Graphite particle were fabricated by powder metallurgy. The density of the composite was tested by Archimedes theory, and the hardness were tested by FEM-700-type meter, and friction and wear properties of materials was tested by MG-2000 high-speed high temperature friction and wear tester. The results show that the copper matrix composites reinforced by SiC and Graphite particles are successfully fabricated by powder metallurgy, and the particle distribution is uniform, the hardness of composite materials decrease with the increasing of graphite content, and the hardness of composite materials increase with increasing of SiC content, the wear resistance of composite materials increases with the graphite content increase. This study not only extends theoretical scope of the study of the particle reinforced copper matrix composite, but also on application of practical significance of the copper matrix composites instead of copper and copper alloy.
Keywords :
copper; friction; graphite; hardness; particle reinforced composites; powder metallurgy; silicon compounds; wear resistance; wear testing; wide band gap semiconductors; 2000 high-speed high temperature friction tester; Archimedes theory; C-Cu; FEM-700-type meter; MG-2000 high-speed high temperature wear tester; SiC-Cu; friction properties; hardness; particle distribution; particle reinforced copper matrix composite; powder metallurgy; wear properties; wear resistance; Composite materials; Copper; Educational institutions; Mechanical factors; Resistance; Silicon carbide; Ggraphite; SiC; copper matrix composites; hardness; wear resistance properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Consumer Electronics, Communications and Networks (CECNet), 2012 2nd International Conference on
Conference_Location :
Yichang
Print_ISBN :
978-1-4577-1414-6
Type :
conf
DOI :
10.1109/CECNet.2012.6202168
Filename :
6202168
Link To Document :
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