• DocumentCode
    2133076
  • Title

    Thermal Design Methodology for Low Flow Rate Single-Phase and Two-Phase Micro-Channel Heat Sinks

  • Author

    Lee, Scott ; Qu, Weilin

  • Author_Institution
    Dept. of Mech. Eng., Hawaii Univ., Honolulu, HI
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    19
  • Lastpage
    32
  • Abstract
    This study provides a comprehensive thermal design methodology for both single-phase and two-phase micro-channel heat sinks under a fixed liquid coolant flow rate. The parameters relevant to heat sink design are grouped into geometrical parameters, operating parameters, and thermal/fluid parameters. The objective of the proposed thermal design methodology is to determine micro-channel dimensions leading to the most desirable heat sink performance corresponding to a given dissipative heat flux and liquid coolant flow rate. An acceptable design region is first identified which encompasses all possible micro-channel dimensions corresponding to the prescribed dissipative heat flux and liquid coolant flow rate. Heat sink performance maps are then constructed within the acceptable design region. Finally, micro-channel dimensions yielding most desirable heat sink performance can be selected using the performance maps
  • Keywords
    cooling; heat sinks; microchannel flow; thermal management (packaging); two-phase flow; dissipative heat flux; electronic cooling; flow boiling; liquid coolant flow rate; liquid cooling; microchannel heat sinks; single-phase flow; two-phase flow; Coolants; Design methodology; Fluid flow; Heat recovery; Heat sinks; Heat transfer; Temperature; Thermal conductivity; Thermal expansion; Thermal factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645319
  • Filename
    1645319