Title :
Improving of High-Speed Modules by an Advanced Chip-in-Board Assembly
Author :
Hanke, Gerhard ; Nohr, Wolf-Dieter
Author_Institution :
Deutsche Telekom AG, Technologic/cntrum Darmstadt, Am Kavalleriesand 3, 64 295 Darmstadt, Germany. Phone: +49 6151 83 3526, Fax: 449 6151 83 4465, E-mail: hanke@tzd.telekom.de
Abstract :
For an experimental ETDM fiber transmission systems working at 20 Gbit/s and an OTDN 40 Gbit/s system the electronic transmitter. receiver. and amplifier modules were developed. To guarantee reliable and error free operation unpackaged GaAs- and Si-chips on ceramic thinfilm substrates in combination with a sophisticated interconnection technology had to be used. We call this technology "Reverse Beam Lead"-technic. It uses self-supporting leads at the ceramic substrate which contact the semiconductor chips and it allows low impedance and rather reflection- and discontinuity-free connections even for millimeter-wave applications.
Keywords :
Assembly; Clocks; Driver circuits; Impedance; Optical fibers; Optical modulation; Optical receivers; Optical signal processing; Optical transmitters; Stimulated emission;
Conference_Titel :
Microwave Conference, 1997. 27th European
Conference_Location :
Jerusalem, Israel
DOI :
10.1109/EUMA.1997.337826
