Title :
Copper Cold Plate Technology Comparison
Author :
Akselband, Boris ; Whitenack, Kathryn ; Goldman, Dick
Author_Institution :
Lytron, Inc., Woburn, MA
fDate :
May 30 2006-June 2 2006
Abstract :
As more applications require liquid cooling, the need for a high performance copper cold plate technology becomes more and more pressing. Aluminum cold plate technology is well developed while copper technology has lagged somewhat. This paper describes three flat cold plate technologies that were manufactured and tested. They were compared based on their thermal performance and pressure drop at a constant liquid flow rate. The challenge is to develop a technology with good thermal performance and limited pressure drop. This paper analyzes the test results and highlights the best aspects of the three technologies
Keywords :
aluminium; cooling; copper; thermal engineering; aluminum cold plate technology; copper cold plate technology; liquid cooling; pressure drop; Aluminum; Cold plates; Copper; Electronics cooling; Etching; Heat engines; Heat sinks; Liquid cooling; Thermal conductivity; Water heating;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645335