DocumentCode
2133473
Title
Copper Cold Plate Technology Comparison
Author
Akselband, Boris ; Whitenack, Kathryn ; Goldman, Dick
Author_Institution
Lytron, Inc., Woburn, MA
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
147
Lastpage
150
Abstract
As more applications require liquid cooling, the need for a high performance copper cold plate technology becomes more and more pressing. Aluminum cold plate technology is well developed while copper technology has lagged somewhat. This paper describes three flat cold plate technologies that were manufactured and tested. They were compared based on their thermal performance and pressure drop at a constant liquid flow rate. The challenge is to develop a technology with good thermal performance and limited pressure drop. This paper analyzes the test results and highlights the best aspects of the three technologies
Keywords
aluminium; cooling; copper; thermal engineering; aluminum cold plate technology; copper cold plate technology; liquid cooling; pressure drop; Aluminum; Cold plates; Copper; Electronics cooling; Etching; Heat engines; Heat sinks; Liquid cooling; Thermal conductivity; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645335
Filename
1645335
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