• DocumentCode
    2133631
  • Title

    An Experimental Study of Slot-Jet Impingement and Mist Cooling of Microprocessors

  • Author

    Tay, Andrew A O ; Ang, Simon S T ; Lwin, L.O.

  • Author_Institution
    Dept. of Mech. Eng., Singapore Nat. Univ.
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    175
  • Lastpage
    180
  • Abstract
    This paper describes an experimental study of air slot-impingement and mist cooling of microchannels fabricated on the back of a silicon chip. A rig was designed and fabricated for the experimental study. The test section consisted of a 21 mm times 21 mm square silicon die with 100 mum-wide microchannels etched on its back surface, which were covered with a glass plate to confine the flow through the microchannels. A slot was machined across the glass cover plate to admit air from an inlet manifold. The performance of an air-water mist spray cooling system was also studied experimentally. It was found that an air-water mist spray cooling system can give a higher cooling rate than air-only slot-impingement cooling of microchannels. For the same heat dissipation, it was found that the air-water mist spray cooling system required a much smaller flow rate of air. Comparing with data available in the literature, it was also found that mist cooling of microchannels was much more effective than on plane surfaces
  • Keywords
    cooling; jets; microprocessor chips; sprays; 100 micron; air-water mist spray cooling system; glass cover plate; heat dissipation; microchannel cooling; microprocessor chips; slot-jet impingement; Application software; Electronics cooling; Glass; Heat transfer; Microchannel; Micromechanical devices; Microprocessors; Sensor arrays; Spraying; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645340
  • Filename
    1645340