DocumentCode :
2133698
Title :
Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture
Author :
Brunschwiler, Thomas ; Rothuizen, Hugo ; Fabbri, Matteo ; Kloter, Urs ; Michel, Bruno ; Bezama, R.J. ; Natarajan, Govindarajan
Author_Institution :
Zurich Res. Lab., IBM Res. GmbH, Ruschlikon
fYear :
2006
fDate :
May 30 2006-June 2 2006
Firstpage :
196
Lastpage :
203
Abstract :
We demonstrate submerged single-phase direct liquid-jet-impingement cold plates that use arrays of jets with diameters in the range of 31 to 126 mum and cell pitches from 100 to 500 mum for high power-density microprocessor cooling applications. Using parallel inlet and outlet manifolds, a distributed return concept for easy scaling to 40,000 cells on an area of 4 cm was implemented. Pressure drops < 0.1 bar at 2.5 1/min flow rate have been reached with a hierarchical tree-like double-branching manifold. Experiments were carried out with water jets having Reynolds numbers smaller than 900 at nozzle to heater gaps ranging between 3 to 300 mum. We identified four flow regimes, namely, pinch-off, transition, impingement, and separation, with different influences on heat-removal and pressure-drop characteristics. Parametric analysis resulted in an optimal heat-removal rate of 420 W/cm2 using water as a coolant. For a near optimal design with a gap to inlet diameter ratio of 1.2, we measured a heat-transfer coefficient of 8.7 W/cm2 K and a junction to inlet fluid unit thermal resistance of 0.17 Kcm2 /W (720 mum chip), which is equivalent to a 370 W/cm2 cooling performance at a junction to inlet fluid temperature rise of 63 degC, a pressure drop of 0.35 bar, and a flow rate of 2.5 1/min
Keywords :
cooling; jets; microchannel flow; microprocessor chips; nozzles; thermal management (packaging); 31 to 126 micron; Reynolds number; cold plates; direct liquid jet-impingement cooling; distributed return architecture; hierarchical double-branching manifold; high power-density; micro jet array; micron-sized nozzle array; microprocessor cooling; parameter analysis; tree-like double-branching manifold; water jets; Cold plates; Coolants; Cooling; Electrical resistance measurement; Fluid flow measurement; Microprocessors; Pressure measurement; Semiconductor device measurement; Thermal resistance; Water heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
0-7803-9524-7
Type :
conf
DOI :
10.1109/ITHERM.2006.1645343
Filename :
1645343
Link To Document :
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