• DocumentCode
    2133707
  • Title

    Adhesive mechanical fastener design for use in microassembly

  • Author

    Wang, Lidai ; Mills, James K. ; Cleghorn, William L.

  • Author_Institution
    Dept. of Mech.&Ind. Eng., Toronto Univ., Toronto, ON
  • fYear
    2008
  • fDate
    4-7 May 2008
  • Abstract
    We present an adhesive mechanical fastener design used to construct three-dimensional micro devices. The fastener design includes adhesive bonding and self-alignment mechanisms. A micro probe that bonded to a robotic micromanipulator is employed to pick up and accurately deposit adhesive to a target location. Self-alignment mechanisms are introduced to increase the positioning accuracy. A curing light is applied to harden the adhesive. The cured adhesive keeps the assembled micropart into its position and provides a strong mechanical joint. By using conductive adhesive, a reliable electrical connection is achievable. The adhesive mechanical fastener only requires simple operations, and could reach reliable connections and high positioning accuracy, which is important to automatic microassembly. To demonstrate the feasibility of this method, many three-dimensional MEMS devices have been assembled, which include a three-dimensional rotary optical switch.
  • Keywords
    adhesive bonding; conductive adhesives; curing; fasteners; microassembling; micromanipulators; position control; adhesive bonding; adhesive mechanical fastener design; conductive adhesive; curing light; mechanical joint; microassembly; positioning; robotic micromanipulator; self-alignment mechanisms; three-dimensional MEMS devices; Bonding; Conductive adhesives; Curing; Fasteners; Microassembly; Microelectromechanical devices; Micromanipulators; Probes; Robotic assembly; Robots; Adhesive bonding; mechanical fastener; microassembly; microelectromechanical system; rotary optical switch;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 2008. CCECE 2008. Canadian Conference on
  • Conference_Location
    Niagara Falls, ON
  • ISSN
    0840-7789
  • Print_ISBN
    978-1-4244-1642-4
  • Electronic_ISBN
    0840-7789
  • Type

    conf

  • DOI
    10.1109/CCECE.2008.4564706
  • Filename
    4564706