DocumentCode :
2133717
Title :
Numerical Simulations of Boiling Jet Impingement Cooling in Power Electronics
Author :
Narumanchi, Sreekant ; Troshko, Andrey ; Hassani, Vahab ; Bharathan, Desikan
Author_Institution :
National Renewable Energy Lab., Golden, CO
fYear :
2006
fDate :
May 30 2006-June 2 2006
Firstpage :
204
Lastpage :
214
Abstract :
Boiling jet impingement cooling is currently being explored to cool power electronics components. In hybrid vehicles, inverters are used for DC-AC conversion. These inverters involve a number of insulated gate bipolar transistors (IGBTs), which are used as on/off switches. The heat dissipated in these transistors can result in heat fluxes of up to 200 W/cm2, which makes the thermal management problem quite important. In this paper, turbulent jet impingement involving nucleate boiling is explored numerically. The framework for these computations is the CFD code FLUENT. For nucleate boiling, the Eulerian multiphase model is used. A mechanistic model of nucleate boiling is implemented in a user-defined function (UDF) in FLUENT. The numerical results for boiling water jets (submerged) are validated against existing experimental data in the literature. Some representative IGBT package simulations that use R134a as the cooling fluid are also presented
Keywords :
computational fluid dynamics; cooling; insulated gate bipolar transistors; invertors; jets; multiphase flow; power electronics; semiconductor device packaging; thermal management (packaging); turbulence; CFD code; DC-AC conversion; Eulerian multiphase model; FLUENT; IGBT switches; UDF; boiling jet impingement cooling; insulated gate bipolar transistor switches; nucleate boiling; numerical simulations; package simulations; power electronics cooling; user-defined function; Computational fluid dynamics; Electronics cooling; Insulated gate bipolar transistors; Inverters; Numerical simulation; Packaging; Power electronics; Switches; Thermal management; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
0-7803-9524-7
Type :
conf
DOI :
10.1109/ITHERM.2006.1645344
Filename :
1645344
Link To Document :
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