A Novel Multi Chip Module Unifying Transmitter and Receiver at 51 GHz

NEC has successfully developed a compact multi chip module for video and data communications. The transmitter (TX) and receiver (RX) are unified using high density packaging technology which is newly developed in consideration of reliability, e.g. hermetic seal and thermal management, and of low insertion loss RF I/O structure. Pseudomorphic Hetero Junction FETs (P-HJ-FET) are employed for LNA and power amplifier (PA) MMICs to achieve a low noise figure of 6.6 dB and high output power of 19 dBm. And the module also realized an excellent S/N of 60 dBp-p/rms for the NTSC VIDEO signal transmission.