DocumentCode
2133770
Title
A Novel Multi Chip Module Unifying Transmitter and Receiver at 51 GHz
Author
Yakuwa, Naoki ; Akaishi, Makoto ; Kaneko, Tomoya ; Saryo, Tomoaki
Author_Institution
NEC Corporation, 4035, Ikebe-cho, Tsuzuki-ku, Yokohama 224, JAPAN. TEL +81-45-939-2107, FAX +81-45-939-2109, E-mail: yakuwa@dvs.msc.yh.nec.co.jp
Volume
1
fYear
1997
fDate
8-12 Sept. 1997
Firstpage
454
Lastpage
459
Abstract
NEC has successfully developed a compact multi chip module for video and data communications. The transmitter (TX) and receiver (RX) are unified using high density packaging technology which is newly developed in consideration of reliability, e.g. hermetic seal and thermal management, and of low insertion loss RF I/O structure. Pseudomorphic Hetero Junction FETs (P-HJ-FET) are employed for LNA and power amplifier (PA) MMICs to achieve a low noise figure of 6.6 dB and high output power of 19 dBm. And the module also realized an excellent S/N of 60 dBp-p/rms for the NTSC VIDEO signal transmission.
Keywords
Data communication; Hermetic seals; Insertion loss; National electric code; Packaging; Propagation losses; Radio frequency; Technology management; Thermal management; Transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1997. 27th European
Conference_Location
Jerusalem, Israel
Type
conf
DOI
10.1109/EUMA.1997.337841
Filename
4138882
Link To Document