DocumentCode
2134049
Title
Effect of Obstruction Near Fan Inlet on Fan Heat Sink Performance
Author
Khaire, Vivek ; Goswami, Avijit ; Bhandari, J.V.
Author_Institution
Appl. Thermal Technol., Maharashtra
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
321
Lastpage
325
Abstract
Compact electronic enclosures requiring forced air cooling often have airflow obstructions located very close to the fan inlet. The adverse effects of these obstructions are not well understood even using modern CFD techniques. In this study a thorough experimental investigation was carried out on the thermal, airflow and acoustic effects of an obstruction very near to the fan inlet for four fan-heat sink combinations. It was found that as the obstruction was brought closer to fan inlet, the device case temperature increased significantly. This was due to a combined effect of reduction in the fan airflow and an increase in the fan inlet air temperature. The overall degradation in performance was more severe for obstruction heights less than 15mm. A reversal in the fan flow direction was observed for one fan when the obstruction was very close to the fan inlet (less than 7mm). The acoustic noise level (sound power) also went up for 3 of the 4 fan heat sinks which was partly due to an observed natural increase in the fan rotational speed. The thermal performance improved when the fan speed was artificially increased but with higher sound power levels
Keywords
electronics packaging; fans; heat sinks; CFD techniques; acoustic noise level; compact electronic enclosures; fan heat sink interaction; fan inlet; fan rotational speed; fan speed; forced air cooling; heat sink thermal performance; higher sound power levels; reverse fan flow; sound power level; Electronics cooling; Geometry; Heat sinks; Printed circuits; Resistance heating; Space cooling; Space heating; Temperature; Thermal resistance; Trigeneration;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645359
Filename
1645359
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