DocumentCode
2134337
Title
Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Heat Fluxes in Excess of 500 W/FT2
Author
Shrivastava, Saurabh K. ; Sammakia, Bahgat G. ; Schmidt, Roger ; Iyengar, Madhusudan ; VanGilder, James W.
Author_Institution
American Power Conversion Corp., Billerica, MA
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
402
Lastpage
411
Abstract
The current trend of using denser server environments is continuously increasing to satisfy the growing needs of e-commerce and other emerging technologies. The resulting high room-level heat fluxes present significant challenges with respect to maintaining acceptable computer rack inlet temperatures and minimizing total data center energy consumption. Numerical methods are widely used to model existing and new facilities. Validation of existing numerical techniques is an important step in facilitating good thermal design of data centers. This paper uses previously published experimental data to present a comparison between test results and numerical simulations. The example considered is a large 7400 ft2 data canter that houses over 130 heat-producing racks (1.2 MW) and 12 air conditioning units. Localized hot spot heat fluxes were measured to be as high as 512 W/ft2 (5.5 kW/m2) for a 400 ft (37 m) region. A numerical model based on computational fluid dynamics (CFD) was constructed using inputs from the measurements. The rack inlet air temperature was considered to be the basis for experimental vs. numerical comparison. The overall mean rack inlet temperature predicted numerically at a height of 1.75 m is within 4degC of the test data with a rack-by-rack standard deviation of 3.3 degC
Keywords
air conditioning; computational fluid dynamics; computer centres; heat conduction; numerical analysis; temperature distribution; 1.2 MW; air conditioning units; computational fluid dynamics; computer rack inlet temperatures; data center energy consumption; denser server environments; e-commerce; heat-producing racks; high room-level heat fluxes; high-density data center; hot spot heat fluxes; rack inlet air temperature; thermal design; Computational fluid dynamics; Cooling; Costs; Energy consumption; Large-scale systems; Numerical models; Power conversion; Temperature; Testing; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645371
Filename
1645371
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