• DocumentCode
    2134525
  • Title

    Data center power projections to 2014

  • Author

    Belady, Christian ; Malone, Christopher

  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    439
  • Lastpage
    444
  • Abstract
    With the densification of electronics, predictions for electronics power trends have been closely watched. For semiconductors, the ITRS (International Technology Roadmap for Semiconductors) has published power trends for processors for years. For electronic equipment such as servers, Uptime published a power trend in 2000 and more recently in 2004, ASHRAE published the "Datacom Equipment Power Trends and Applications" book that updated the uptime data and projected power for datacom equipment out to 2014. While this work has been extremely useful to the industry, it has caused some credibility issues with our end-users. If one takes the ASHRAE power trend at face value and assumes that all servers consume the projected power, the result would show that today\´s data centers should require in excess of 500 W/ft2. In reality, based on some customer data, the average data center capacity is only 61 W/ft2. A data center power density projection is needed so that IT organizations can develop data centers with adequate cooling for reasonable lifetimes. The paper discusses the need for something more than processor and equipment power trend projections which have overestimated the required infrastructure for customers. Among the reasons discussed will be data center power diversity as well proposing a new power projection from the data center perspective. This projection uses data from a survey of actual enterprise data centers and the ASHRAE projections to formulate a data center power trend projection
  • Keywords
    air conditioning; computer centres; cooling; data communication equipment; cooling; data center; datacom equipment; electronic equipment power; electronics densification; power projections; power trends; Books; Cooling; Electronic equipment; Energy management; Heat engines; Microprocessors; Project management; Refrigeration; Societies; Telecommunications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645376
  • Filename
    1645376