Interconnects and Packaging for MMIC´S

This contribution reviews a number of aspects relevant for interconnects and packaging of monolithic integrated millimeter-wave circuits, possibly combined with hybrid or even waveguide circuits. Topics are packaging and front-end architecture, package materials, and standard interconnects to microstrip or coplanar MIMIC´s. Following this, a special interconnect technique based on electromagnetic field coupling is presented. Finally, as a system application, the front-end of a 77 GHz automotive radar is described.