Thermal analysis method of seamless transition metamodel from rough to high accuracy

A large feedback loop of the design from the thermal detail design to the outline design was occurred on the high performance mobile terminal design. The cause was that the device layout is decided only by the viewpoint of the circuit design on the outline design stage. Therefore, the outline thermal layout design method has been needed. For this purpose, we had developed the first order analysis and the design method based on the modularized rough model (Analysis accuracy of the device temperature is about 3% or less at case study model, Design-speed about 150sec) (Iwata et al., 2005). But the accuracy of the thermal analysis was still a little poor at the critical devices. Then, we needed the high accuracy analysis method for checking the design solution, and the seamless transition from the first order analysis to the high accuracy analysis for shortening the total time of thermal layout design. In this report, we developed the high accuracy analysis method that has the high accuracy approximately equal to FEM analysis with seamless transition from the first order analysis. Then, we make improvements of the device module model and the analysis method. By using the high accuracy analysis method, the maximum analysis error of the temperature distribution of the device module is improved from about 44% to about 3%. Furthermore at case study, the analysis time is about 1 sec or less and analysis accuracy is less than 2% at the temperature distribution on a chip