DocumentCode
2135586
Title
Newisys server processor cooling augmentation using synthetic jet ejectors
Author
Mahalingam, Raghav ; Heffington, Samuel ; Jones, Lee ; Schwickert, Markus
Author_Institution
Innovative Fluidics, Inc., Austin, TX
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
705
Lastpage
709
Abstract
This paper focuses on an implementation of synthetic jet ejectors for enhancing existing fan performance by controlling the bypass flow and imparting additional momentum to the flow. Synthetic or "zero-mass-flux" jets, unlike conventional jets, require no mass addition to the system, and thus provide means of efficiently directing airflow across a heated surface. Because these jets are zero net mass flux in nature and are comprised entirely of the ambient fluid, they can be conveniently integrated with the surfaces that require cooling without the need for complex plumbing. Wind tunnel tests are used to characterize the performance of an array of localized synthetic jets cooling two high density heat sinks in the presence of varying mean flows. The increased flow rate and heat dissipation due to the jets is measured. Results show that the percentage improvement in heat transfer due to the Synjets depends strongly on the relative flow rates of the Synjet and the mean flow. A NEWISYS server chassis was retrofitted with a synthetic jet module such that no changes to the mechanicals of the chassis were necessary. Two AMD processors in the server were stressed for high heat dissipation. It is shown that operating a synthetic jet in conjunction with a fan enables higher heat dissipation due to localized cooling by the synthetic jets without impeding the flow of the fan. The high momentum Synjets enable the entrainment of significantly higher flows and heat dissipation through the heat sink than the fan alone. It is also shown the adding the Synjets enables a reduction in fan RPM for equivalent thermal performance, thus resulting in significant reduction in the sound pressure levels
Keywords
cooling; fans; heat sinks; jets; microprocessor chips; thermal management (packaging); AMD processors; NEWISYS server chassis; NEWISYS server processor; Synjet; bypass flow; cooling augmentation; fan performance; heat dissipation; heat sink; heat sinks; heat transfer; heated surface; synthetic jet ejectors; synthetic jets; wind tunnel tests; zero net mass flux; zero-mass-flux jets; Fans; Fluid flow control; Fluidics; Heat sinks; Heat transfer; Liquid cooling; Power dissipation; Temperature control; Testing; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645415
Filename
1645415
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