• DocumentCode
    2135586
  • Title

    Newisys server processor cooling augmentation using synthetic jet ejectors

  • Author

    Mahalingam, Raghav ; Heffington, Samuel ; Jones, Lee ; Schwickert, Markus

  • Author_Institution
    Innovative Fluidics, Inc., Austin, TX
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    705
  • Lastpage
    709
  • Abstract
    This paper focuses on an implementation of synthetic jet ejectors for enhancing existing fan performance by controlling the bypass flow and imparting additional momentum to the flow. Synthetic or "zero-mass-flux" jets, unlike conventional jets, require no mass addition to the system, and thus provide means of efficiently directing airflow across a heated surface. Because these jets are zero net mass flux in nature and are comprised entirely of the ambient fluid, they can be conveniently integrated with the surfaces that require cooling without the need for complex plumbing. Wind tunnel tests are used to characterize the performance of an array of localized synthetic jets cooling two high density heat sinks in the presence of varying mean flows. The increased flow rate and heat dissipation due to the jets is measured. Results show that the percentage improvement in heat transfer due to the Synjets depends strongly on the relative flow rates of the Synjet and the mean flow. A NEWISYS server chassis was retrofitted with a synthetic jet module such that no changes to the mechanicals of the chassis were necessary. Two AMD processors in the server were stressed for high heat dissipation. It is shown that operating a synthetic jet in conjunction with a fan enables higher heat dissipation due to localized cooling by the synthetic jets without impeding the flow of the fan. The high momentum Synjets enable the entrainment of significantly higher flows and heat dissipation through the heat sink than the fan alone. It is also shown the adding the Synjets enables a reduction in fan RPM for equivalent thermal performance, thus resulting in significant reduction in the sound pressure levels
  • Keywords
    cooling; fans; heat sinks; jets; microprocessor chips; thermal management (packaging); AMD processors; NEWISYS server chassis; NEWISYS server processor; Synjet; bypass flow; cooling augmentation; fan performance; heat dissipation; heat sink; heat sinks; heat transfer; heated surface; synthetic jet ejectors; synthetic jets; wind tunnel tests; zero net mass flux; zero-mass-flux jets; Fans; Fluid flow control; Fluidics; Heat sinks; Heat transfer; Liquid cooling; Power dissipation; Temperature control; Testing; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645415
  • Filename
    1645415