DocumentCode
2135993
Title
Zero offset drift suppression in SiC pressure sensors at 600 °C
Author
Okojie, Robert S. ; Blaha, Charles ; Lukco, Dorothy ; Nguyen, Vu ; Savrun, Ender
Author_Institution
NASA Glenn Res. Center, Cleveland, OH, USA
fYear
2010
fDate
1-4 Nov. 2010
Firstpage
2269
Lastpage
2274
Abstract
Temporal drifts in zero pressure offset voltage, Voz, observed in piezoresistive silicon carbide (SiC) pressure sensors at 600 °C were significantly suppressed to allow reliable operation. By modifying the bondpad/contact metallization, the Vη relative drift velocity at 600 °C was suppressed to within ± 0.5 mV.hr-1, for over 1000 hours. Microstructural changes within the contact metallization were analyzed with Auger Electron Spectroscopy (AES) and Scanning Electron Microscopy (SEM). This metallization scheme may improve SiC pressure sensor reliability in short duration ground/flight tests and lower temperature (~300 °C) remote pressure monitoring (i.e., geothermal, and deep well drilling).
Keywords
Auger electron spectroscopy; contact resistance; metallisation; piezoresistive devices; pressure sensors; remote sensing; scanning electron microscopy; silicon compounds; wide band gap semiconductors; Auger electron spectroscopy; SEM; SiC; bondpad/contact metallization; deep well drilling; geothermal pressure monitoring; piezoresistive pressure sensors; remote pressure monitoring; scanning electron microscopy; temperature 600 C; zero offset drift suppression;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2010 IEEE
Conference_Location
Kona, HI
ISSN
1930-0395
Print_ISBN
978-1-4244-8170-5
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2010.5690714
Filename
5690714
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