• DocumentCode
    2135993
  • Title

    Zero offset drift suppression in SiC pressure sensors at 600 °C

  • Author

    Okojie, Robert S. ; Blaha, Charles ; Lukco, Dorothy ; Nguyen, Vu ; Savrun, Ender

  • Author_Institution
    NASA Glenn Res. Center, Cleveland, OH, USA
  • fYear
    2010
  • fDate
    1-4 Nov. 2010
  • Firstpage
    2269
  • Lastpage
    2274
  • Abstract
    Temporal drifts in zero pressure offset voltage, Voz, observed in piezoresistive silicon carbide (SiC) pressure sensors at 600 °C were significantly suppressed to allow reliable operation. By modifying the bondpad/contact metallization, the Vη relative drift velocity at 600 °C was suppressed to within ± 0.5 mV.hr-1, for over 1000 hours. Microstructural changes within the contact metallization were analyzed with Auger Electron Spectroscopy (AES) and Scanning Electron Microscopy (SEM). This metallization scheme may improve SiC pressure sensor reliability in short duration ground/flight tests and lower temperature (~300 °C) remote pressure monitoring (i.e., geothermal, and deep well drilling).
  • Keywords
    Auger electron spectroscopy; contact resistance; metallisation; piezoresistive devices; pressure sensors; remote sensing; scanning electron microscopy; silicon compounds; wide band gap semiconductors; Auger electron spectroscopy; SEM; SiC; bondpad/contact metallization; deep well drilling; geothermal pressure monitoring; piezoresistive pressure sensors; remote pressure monitoring; scanning electron microscopy; temperature 600 C; zero offset drift suppression;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2010 IEEE
  • Conference_Location
    Kona, HI
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-8170-5
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2010.5690714
  • Filename
    5690714