Thermal management of a stacked-die package in a handheld electronic device using passive solutions

Author

Moon, Sung-Won ; Prstic, Suzana ; Chiu, Chia-Pin

Author_Institution

Assembly Technol. Dev., Intel Corp., Chandler, CA

fYear

2006

fDate

May 30 2006-June 2 2006

Firstpage

791

Lastpage

797

Abstract

Various passive thermal management schemes are discussed for a high power component in a handheld electronic device. The validated package and system thermal model based on JEDEC standards and a cell phone mock-up testing were used for the extensive analysis. Also the empirical data was collected to validate thermal improvement predicted by CFD analysis. By using the validated thermal model, the design cycle and time-to-market can be significantly reduced

Keywords

computational fluid dynamics; cooling; mobile handsets; thermal management (packaging); CFD analysis; JEDEC standards; cell phone mock-up testing; electronic cooling; handheld electronic device; passive thermal management schemes; stacked-die package; system level model; thermal modeling; Cellular phones; Computational fluid dynamics; Electronic packaging thermal management; Energy management; Power system management; Power system modeling; System testing; Thermal management; Thermal management of electronics; Time to market;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on

Conference_Location

San Diego, CA

ISSN

1087-9870

Print_ISBN

0-7803-9524-7

Type

conf

DOI

10.1109/ITHERM.2006.1645428

Filename

1645428