Simulation of Sn-0.7Cu solder with bodner partom constitutive model

This paper employed the Bodner-Partom model to simulate the stress-strain relationship of the Sn-0.7Cu lead-free solder. The model has only five material constants which can be achieved by the tension test. Tension tests with different strain rates and cyclic tests with six different load paths were performed on a minitype tension-torsional testing machine. The simulations have shown that the model is precise enough to reflect the rate-dependence and to calculate the stable cyclic stress-strain relationship under different load paths