Title :
Design parameters influencing reliability of CCGA assembly: a sensitivity analysis
Author :
Tasooji, Amaneh ; Ghaffarian, Reza ; Rinaldi, Antonio
Author_Institution :
Arizona State Univ., Tempe, AZ
fDate :
May 30 2006-June 2 2006
Abstract :
Area array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of ceramic column grid array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50deg/75 degC, -55deg/100degC, and -55deg/125degC), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model´s predictions with the experimental thermal cycling data. Finite element method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies
Keywords :
ball grid arrays; ceramic packaging; finite element analysis; integrated circuit design; integrated circuit reliability; life testing; sensitivity analysis; soldering; solders; thermal analysis; thermal stability; -50 to 75 C; -55 to 100 C; -55 to 125 C; CCGA assembly reliability; FEM analysis; JPL thermal cycle; area array microelectronic packages; ceramic column grid array; finite element method; microelectronics packaging; sensitivity analysis; solder; stress conditions; thermal cycling data; Assembly; Ceramics; Finite element methods; Materials reliability; Microelectronics; Packaging; Predictive models; Sensitivity analysis; Testing; Thermal stresses;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645461
