Evaluation Method of Board Level Drop Reliability for Electronic Component and Parametric Analysis

The purpose of this study was to analyze the drop reliability of solder joints in assembled IC package on print wiring board (PWB) from viewpoint of structure of test equipment. Considering reliability of mobile devices, it was important to establish the drop reliability for solder joints. In this paper, the repetitive drop test with simple equipment was carried out to evaluate the drop reliability. In repetitive drop test, IC package assembled on PWB was fixed on a fixture, so that the deformation of fixture influenced PWB and solder joints of assembled PWB, consequently. Therefore, it was very important to evaluate the relationship between fixture and PWB. Initially the fixture was verified, and the influence to PWB and IC package was evaluated using experimental analysis and simulation. In addition, analysis of variance (ANOVA) with simulation was utilized for assessing each influence of factor. It was confirmed that 1) the energy from fixture spread to PWB when colliding and 2) the spread energy was highly relevant with the stress at solder joint. Additionally the significances of factors were clarified in terms of drop reliability