• DocumentCode
    2137133
  • Title

    The effect of varying heat sink fin distances from cooling fan blade tip on noise emissions

  • Author

    Ule, Helen ; Novak, Colin ; Gaspar, Robert ; Wiley, Robert ; Refai-Ahmed, Gamal

  • Author_Institution
    Mech., Automotive & Mater. Eng., Windsor Univ., Ont.
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    1077
  • Lastpage
    1081
  • Abstract
    The challenge to deliver performance improvements in computer graphic cards has surpassed the ability of finned, passive, cooling devices to dissipate the heat generated by next generation graphics processing units (GPU). The dissipation rates required by these latest GPU designs can only be delivered by more complicated thermal management systems which often require forced air cooling of finned heat sinks. The concurrent challenge to the industry is to provide this cooling while minimizing the noise generated by these cooling fans. One of the fundamental mechanisms for the generation of fan noise is the dynamic force fluctuations on the fan blade and how these fluctuations interact with fixed irregularities such as adjacent cooling fins. This study investigates the effect on the acoustic emissions resulting from the variation of the distance between the fan blade tips and the heat sink fins. A discussion and comparison of the measured results was presented using both traditional analysis techniques as well as psychoacoustic or sound quality metrics. It was found that a minimum distance between the blade and adjacent obstructions is desired in order to minimize excessive noise levels. The minimization of the noise emissions also had a desirable effect on the sound quality analysis
  • Keywords
    acoustic variables control; acoustics; cooling; electronics packaging; heat sinks; microprocessor chips; noise abatement; semiconductor device noise; GPU designs; acoustic emissions; computer graphic cards; cooling fan blade tip; graphics processing units; heat sink fin distance; noise emissions; psychoacoustic metric; sound quality analysis; sound quality metric; Acoustic noise; Blades; Computer graphics; Cooling; Fans; Fluctuations; Heat sinks; Noise generators; Thermal force; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645464
  • Filename
    1645464