• DocumentCode
    2137542
  • Title

    Improving puncher efficiency using a double-loop traveling salesman problem

  • Author

    Xiao-Dong Wang ; Jun Feng ; Bo-ting Qu ; Jia-rong Wang ; Zhen Zan

  • Author_Institution
    Sch. of Inf. & Technol., Northwest Univ., Xi´an, China
  • fYear
    2013
  • fDate
    23-25 July 2013
  • Firstpage
    803
  • Lastpage
    806
  • Abstract
    Making the via holes is an important component part in the production of the printed circuit board. Therefore, how to improve the production efficiency of the puncher is a valuable research topic. In the paper, a novel mathematical model is built for the printed circuit board. Further more, we propose a novel method to solve the novel mathematical model. Furthermore, an improved double loop TSP model with the multiple constraint conditions is employed to solve the improving problem of the production efficiency. The experimental results show that our model can effectively improve the production efficiency of the puncher and the proposed method is more effectively than other traditional algorithms.
  • Keywords
    mathematical analysis; printed circuit manufacture; production management; travelling salesman problems; double loop TSP model; double-loop traveling salesman problem; mathematical model; multiple constraint conditions; printed circuit board production; puncher production efficiency; Educational institutions; Genetic algorithms; Heuristic algorithms; Mathematical model; Production; Simulated annealing; Equivalent network diagram; Floyd; Genetic algorith; Traveling salesman problem;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Natural Computation (ICNC), 2013 Ninth International Conference on
  • Conference_Location
    Shenyang
  • Type

    conf

  • DOI
    10.1109/ICNC.2013.6818085
  • Filename
    6818085