• DocumentCode
    2137616
  • Title

    Towards high fidelity high efficiency MEMS microspeakers

  • Author

    Shahosseini, I. ; Lefeuvre, E. ; Woytasik, M. ; Moulin, J. ; Leroux, X. ; Edmond, S. ; Dufour-Gergam, E. ; Bosseboeuf, A. ; Lemarquand, G. ; Lemarquand, V.

  • Author_Institution
    Inst. d´´Electron. Fondamentale, Univ. Paris Sud, Orsay, France
  • fYear
    2010
  • fDate
    1-4 Nov. 2010
  • Firstpage
    2426
  • Lastpage
    2430
  • Abstract
    This paper presents simulations and microfabrication of different parts of high fidelity electrodynamic MEMS loudspeakers with high electroacoustic conversion efficiency. The originality of the structure lies on the use of rigid silicon membranes suspended by a whole set of silicon beams instead of flexible polymer membranes usually found in MEMS loudspeakers. The microspeaker structure includes a planar copper microcoil electroplated on the silicon membrane and permanent magnets bonded on the substrate. Microstructure of the silicon membrane was optimized using FEM simulations for providing both rigidity and lightness of the mobile part. The results presented on a deep RIE etched 15 mm diameter silicon membrane structured with 40 stiffening ribs and on a 30 μm thick microcoil with 35 turns experimentally show the feasibility of key stages required for manufacturing of MEMS microspeakers with outstanding properties.
  • Keywords
    acoustoelectric devices; electrodynamics; finite element analysis; loudspeakers; microfabrication; micromechanical devices; polymers; sputter etching; FEM simulation; MEMS microspeaker; RIE etched silicon membrane; Si; distance 15 mm; electroacoustic conversion efficiency; electrodynamic MEMS loudspeaker; flexible polymer membrane; microfabrication; permanent magnet; planar copper microcoil electroplated; silicon beam; size 30 mum;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2010 IEEE
  • Conference_Location
    Kona, HI
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-8170-5
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2010.5690782
  • Filename
    5690782