Optimization of packaging materials and design for thermal management in stacked-die packages

Author

Moon, Sung-Won ; Dizon, Michael ; Chiu, Chia-Pin ; Garcia, Enrico

Author_Institution

Assembly Technol. Dev., Intel Corp., Chandler, AZ

fYear

2006

fDate

May 30 2006-June 2 2006

Firstpage

1226

Lastpage

1231

Abstract

Various package level thermal management schemes are discussed. Extensive sensitivity study data of thermally conductive packaging materials such as die adhesive, mold compound, and board level underfill are reviewed on different package architectures by using JEDEC standards. Thermal benefits of heat spreader embedded stacked-die packages are also investigated. By using the validated detailed package thermal model, the design cycle and time-to-market can be significantly reduced

Keywords

adhesives; optimisation; thermal management (packaging); time to market; JEDEC standards; board level underfill; die adhesive; heat spreader; mold compound; package architectures; package thermal model; packaging materials; reduced design cycle; stacked-die packages; thermal management; time-to-market; Computational fluid dynamics; Conducting materials; Design optimization; Electronic packaging thermal management; Immune system; Surface resistance; Temperature; Thermal conductivity; Thermal management; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on

Conference_Location

San Diego, CA

ISSN

1087-9870

Print_ISBN

0-7803-9524-7

Type

conf

DOI

10.1109/ITHERM.2006.1645485

Filename

1645485