Title :
Optimization of packaging materials and design for thermal management in stacked-die packages
Author :
Moon, Sung-Won ; Dizon, Michael ; Chiu, Chia-Pin ; Garcia, Enrico
Author_Institution :
Assembly Technol. Dev., Intel Corp., Chandler, AZ
fDate :
May 30 2006-June 2 2006
Abstract :
Various package level thermal management schemes are discussed. Extensive sensitivity study data of thermally conductive packaging materials such as die adhesive, mold compound, and board level underfill are reviewed on different package architectures by using JEDEC standards. Thermal benefits of heat spreader embedded stacked-die packages are also investigated. By using the validated detailed package thermal model, the design cycle and time-to-market can be significantly reduced
Keywords :
adhesives; optimisation; thermal management (packaging); time to market; JEDEC standards; board level underfill; die adhesive; heat spreader; mold compound; package architectures; package thermal model; packaging materials; reduced design cycle; stacked-die packages; thermal management; time-to-market; Computational fluid dynamics; Conducting materials; Design optimization; Electronic packaging thermal management; Immune system; Surface resistance; Temperature; Thermal conductivity; Thermal management; Thermal resistance;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645485
