DocumentCode :
2137875
Title :
Thermal conductivity of amorphous silica using non-equilibrium molecular dynamics simulations
Author :
Mahajan, S. ; Subbarayan, G. ; Sammakia, B.G.
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN
fYear :
2006
fDate :
May 30 2006-June 2 2006
Lastpage :
1275
Abstract :
In several recent applications, including those aimed at developing thermal interface materials, nano-particulate systems have been proposed to improve the effective behavior of the system. While nano-particles by themselves may have low conductivities, their use along with larger particles is believed to enhance the percolation threshold leading to better materials overall. One crucial challenge in using nano-particulate systems is the lack of knowledge regarding their thermal conductivity. A non-equilibrium molecular dynamics approach is used in this paper to determine the thermal conductivity of clusters of atoms without periodic boundary conditions. This method is first tested on bulk amorphous silica and conductivity values are compared to those reported in the literature. The method is then modified in order to study silica clusters. This modified approach is an approximation to the actual physical heat-transfer process in a cluster. Three different system sizes consisting 300, 600 and 900 atom clusters are considered and the values of conductivity for each are reported. The conductivity values obtained range from 1.49 W/mK to 1.94 W/mK. No significant effect of the cluster size on the thermal conductivity was found
Keywords :
amorphous semiconductors; heat transfer; molecular dynamics method; nanoparticles; thermal conductivity; thermal diffusivity; amorphous silica; cluster size; molecular dynamics simulations; nanoparticulate systems; percolation threshold; thermal conductivity; thermal interface materials; Amorphous materials; Boundary conditions; Conducting materials; Mechanical engineering; Nanostructured materials; Silicon compounds; Temperature; Testing; Thermal conductivity; Thermal engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
0-7803-9524-7
Type :
conf
DOI :
10.1109/ITHERM.2006.1645491
Filename :
1645491
Link To Document :
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