Characterization of metal on elastomer vertical interconnections

Author

Colomb, F. ; Eastman, K. ; Roman, J.

Author_Institution

Adv. Device Center, Raytheon Co., Andover, MA, USA

Volume

1

fYear

1996

fDate

17-21 June 1996

Firstpage

75

Abstract

A metal on elastomer vertical interconnection for multilayer microwave modules is presented. Measured insertion loss is 0.5 dB at 6 GHz. Layer to layer lateral misalignment of the substrates by as much as /spl plusmn/0.006 inch causes only a 0.1 dB degradation in performance. A two-tier design approach is presented for first analyzing the vertical strips as a uniform multiconductor transmission line and then for including the interactions of all discontinuities in a 3D simulation using the finite element method.

Keywords

finite element analysis; losses; microstrip lines; microwave circuits; packaging; 0.5 dB; 3D simulation; 6 GHz; finite element method; insertion loss; metal on elastomer vertical interconnections; multilayer microwave modules; substrate lateral misalignment; two-tier design; uniform multiconductor transmission line; Analytical models; Degradation; Finite element methods; Insertion loss; Loss measurement; Multiconductor transmission lines; Nonhomogeneous media; Strips; Transmission line discontinuities; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1996., IEEE MTT-S International

Conference_Location

San Francisco, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-3246-6

Type

conf

DOI

10.1109/MWSYM.1996.508466

Filename

508466