DocumentCode :
2138009
Title :
Thermal Properties of Metal-Coated Vertically-Aligned Single Wall Nanotube Films
Author :
Panzer, M. ; Zhang, G. ; Mann, D. ; Hu, X. ; Pop, E. ; Dai, H. ; Goodson, K.E.
Author_Institution :
Stanford Univ., CA
fYear :
2006
fDate :
May 30 2006-June 2 2006
Firstpage :
1306
Lastpage :
1313
Abstract :
Owing to their extraordinarily high thermal conductivities, carbon nanotubes (CNTs) are promising for use in advanced thermal interface materials (TIMs). While there has been much previous research on carbon nanotube thermal properties, there are little data for aligned films of single wall nanotubes. This paper measures the thermal interface resistances of metal-coated vertically-aligned single wall CNT (SWNT) arrays using a nanosecond pump/probe thermoreflectance technique. The data capture the vertical variation of CNT thermal properties including their interface resistances. The data show the total thermal resistance of the TIM is R"swnt,tot=1.2 times 10-5 m2 KW-1, and that the CNT-metal interface resistance strongly reduces the effective vertical thermal conductivity. An approximate model shows that the evaporated metal film contacts only a small fraction of the CNTs. Based on the conclusions of the model, the individual CNT-metal contact conductance is hcnt-metal,a=6.6 times 107 Wm-2K-1 which is quite good. Increasing the number of CNT-substrate contacts is a very promising approach for improving the thermal performance of CNT-based interface materials
Keywords :
carbon nanotubes; contact resistance; thermal conductivity; thermal resistance; thermoreflectance; carbon nanotubes; single wall nanotubes; thermal conductivity; thermal interface materials; thermal interface resistances; thermal properties; thermoreflectance thermometry; Acoustic materials; Carbon nanotubes; Conducting materials; Impedance; Organic materials; Temperature; Thermal conductivity; Thermal management; Thermal resistance; Thermoreflectance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
0-7803-9524-7
Type :
conf
DOI :
10.1109/ITHERM.2006.1645496
Filename :
1645496
Link To Document :
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